Qfn lead frame design rules books

Semiconductor qfn package with advanced interlocking design. Recommendations for board assembly of infineon discrete. Except for the metal lead frame we mentioned above, ase also provide design service for tape base material, include film flux, substrate, tape bga, cof, tcp, and ubga. They generally have superior lead inductance characteristics. Qfn microleadframe mlf lfcsp vqfn dfn amkor technology. Molded lead frames precision plastic and optical components. Dualrow qfn packages have interstitial, staggered contacts. This package is also known as quad flat nonleaded qfn, leadframe chip scale package lfcsp, microleadframe mlf, mlp, lpcc, qlp, and hvqfn. Texas instruments ti quad flatpack nolead qfn 141620terminal pbfree plastic packages meet dimensions specified in. Qfn is a lead frame based package which is also called csp chip scale package with the ability to view and contact leads after assembly. Master lead frame designer mlfd by cad design software. Global chip materials manufactures premolded open cavity qfn packages in standard jedec body sizes and lead counts. Lead frame material which allows traces to be routed through etching process higher io density compared to qfn high design flexibility bgalga utacs new generation of leadframepackage design grid array qfn gqfn.

By continuing to browse this site, you are agreeing to our use of cookies. Reproduction of information in ti data books or data sheets is permissible only. Qfn lead frame exposed underneath, shorting to via under. Some key qfn design considerations are pad and stencil design. This document does not discuss integrated quadflat no lead. Development of a premold leadframe for multirow qfn package. The quad flat pack no leads qfn style of leadless packaging also. A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the largescale circuitry on electrical devices and circuit boards. Ishikawa diagram for qfn wire bond process quality qfn wire bond quality material method machine man capillary selection gold wire selection lead frame design tape selection transducer frequency ppart design indexing and clamping methods looping modes. A new configurable sintered interconnect qfn package for high. Quad flat no lead qfn application note and best practices objective the purpose of this application note and best practices guide is to describe the qfn type component and provide testing methodology and best practices to ensure robust testing and quality results.

Thermal performance is an important aspect of any power converter design. Ic lead frame materials overview sealing materials are used widely in the production of electron tubes, transistors, integrated circuits, cathode ray tubes, etc. Common process defect identification of qfn packages using optical and xray inspection david bernard dage precision industries. Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are. Components, packaging and manufacturing technology chapter, scv section aprill 7, 2015. Generally, lead frame based packages such as qfn offer the most competitive cost structure and is suitable for medium io applications, the technology, however, is constrained by having only fanout capability, insufficient design layout flexibility and relatively higher parasitics. Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are applied. The advanced drc software verifies all complex lead frame and wire bonding design rules. Dec 04, 2015 a new configurable sintered interconnect qfn package for high performance, high lead count and low cost applications abstract. Pss can help you select the right package for your ic, sip or discrete component. Interconnect signal and power integrity sipi thermal management.

The preplated lead frame ppf provides an alternative. Utilizing only substratebased etched lead frames that have been plated with nickelpalladiumgold nipdau technology, we are able to mold a variety of thermoplastics onto lead frames to form customized cavity substrates for electronic packaging. The sheet is automatically transferred over the alignment pins of the shear drive and lowered onto the pins. The lead frame sheet is picked up by the sheet transfer rack using vacuum and raised up off the stack. Configurable sintered interconnect csi for semiconductor. The qfn can have a single or a multiple rows of pins. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and outside of the lead frame is cutoff, separating all leads. The economic manufacture of lead frames a technical. The user is ultimately responsible for determining the suitability of their own design.

Most kinds of integrated circuit packaging are made by placing the silicon chip on a lead frame, then wire bonding the chip to the metal leads of that lead frame, and then covering the chip with plastic. Package and process design augmentation of qfn leadframe. This helps solve problems where component height may be a problem. Flat noleads, also known as micro leadframe mlf and son smalloutline. Development and package characterization of advance leadless leadframe package. Skymart paper leadframe no limit to design, beyond mold. A new configurable sintered interconnect qfn package for. With the spurt in growth of consumer driven smart phones market and significant resources invested in internet of things iot where both form factor and cost play a major role, there is a need for packaging solution. The quad flat no lead qfn package is a leadless nearchipscale package csp that is growing in popularity due to its compact size, reduced weight, and excellent thermal and electrical characteristics. The quickest way to find any asic design companies, ip cores and service providers for asic design, verification, packaging, testing, validation and turnkey services. The qfn package is a near chip scale plastic encapsulated molded or air cavity package with a copper lead frame substrate, the electrical contact to pcb. Elimination of esd events and optimizing waterjet deflash process for reduction of leakage current failures on qfn mr lead frame devices. At present, substrate with ball grid array is often preferred as the market trend for more pin counts requisition.

I have a qfn package which, it turns out, has the lead frame exposed on the underside of the device. Find qfn lead frame design rules related suppliers, manufacturers, products and specifications on globalspec a trusted source of qfn lead frame design rules information. The lead frame for qfn is offered by chang way industries co. The name leadframe or leadframe is actually very accurate. Csi technology frame is a more rigid platform for qfn and other packaging solutions. Madera solutions llc packaging evolution fourth wave 14 high density lead frames and substrates standardized. Assembly guidelines for qfn quad flat no lead and son small outline no lead packages rev. Qfn is a lead framebased package which is also called csp chip scale.

Generally, leadframe based packages such as qfn offer the most competitive cost structure and is suitable for medium io applications, the technology, however, is constrained by having only fanout capability, insufficient design layout flexibility and relatively higher parasitics. Ipc7526 stencil and misprinted board cleaning hand book. The intent of this application note is to provide pcb designers with a set of guidelines for successful board mounting of tagores quad flat noleads qfn packages. Among the most prominent of the new offerings is the qfn quad flat no lead. Soic8 224 units per lead frame qfn 16ld 1500 units per lead frame soic would require 200 ton press map array would require only 50 ton press clamping force required to control resin bleed. Yet, the cost of substrate is significantly higher than leadframe. Pss is familiar with and can design and implement any package type. Flat noleads, also known as micro leadframe mlf and son smalloutline no leads, is a surfacemount technology, one of several package technologies that connect ics to the surfaces of pcbs without throughholes. The cc256x qfn ic is a bluetooth rf radio device targeted to operate on commercial platforms. If the stencil is too thick for the size of apertures then it can lead to the paste being held by surface tension to the inner walls of the aperture. Design and assembly process considerations for qfn type. Solder paste stencil design for optimal qfn yield and reliability. Leadframe is an alloy frame that consists of the package leads and the paddle. Qfn type package is one of the most cuttingedge ic packaging technologies in the electronics.

Qfn package board level reliability project call for participation webinar project leader. Journal of electrical engineering, david publishing co. Utacs new generation of leadframepackage design grid array qfn gqfn may 6, 2015 4 development in leadless leadframe package quad flat nolead qfn package dual row qfn. When the qfn package design needs to start the assembly house. Quikpak, originally founded in 1994 as spt, was purchased by delphon industries in 2000. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as well as major military and aerospace institutions.

The qfn dimensions used in the land pattern design can be taken from these drawings. Ishikawa diagram framework adopted for analyzing the wirebond challenges in qfn fig a. The name leadframe or lead frame is actually very accurate. Development and package characterization of advance leadless. Higher io density compared to qfn high design flexibility bgalga. It intelligizes existing lead frame blanks or populated lead frames from any source for subsequent processing. Leadless quad flat pack qfn packages are plasticencaps ulated with a copper lead frame substrate, providing a robust, lowcost solution for small form factor applications such as mobile handsets and. Modified sidewall design of qfn package journal of. Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn physically and electrically connect integrated circuits to printed circuit boards. Careful routing and design may be required to ensure that none of the design rules is violated. Existing packages that are currently offered solely with a pb. Lead frames are used in almost all semiconductor packages.

Unfortunately, i have escape vias underneath that device, and they were not tented on top. Sealing materials are used widely in the production of electron tubes, transistors, integrated circuits, cathode ray tubes, etc. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as. Leadframes are used in almost all semiconductor packages. Design and process guidelines for qfns dfr solutions. And tis new tpsm53604 power module solves the thermal design challenge by integrating a very high efficiency ic inside a routable lead frame q fantype package. In this paper, a new and advanced design of leadframe is discussed and presented with improvement in. Apr 29, 2015 over the past 15 years, the implementation of the qfn btc package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. After wire bonding you can automatically create a full solid model that can be exported as acis or step for export to thermal analysis tools.

Refer to published reports, books, papers 410 for this category of. Stack paper leadframe 2 level paper leadframe paper leadframe loc paper leadframe skymart epoxy leadframe skymart mold paper frame paper leadframe. Development and package characterization of advance. Solder paste stencil design for optimal qfn yield and reliability april 29, 2015 ben gumpert, lockheed martin. Flat noleads, also known as micro leadframe mlf and son small outline.

Among the most prominent of the new offerings is the qfn quad flat nolead. Another advantage of this technology is the ease of design for custom. Assembly guidelines for qfn quad flat nolead and son. Quad flat nolead qfn application note and best practices. The frame features are considerably different from the standard copper etch lead frame. Section view of a qfn package sloa122 july 2006 qfn layout guidelines 1 submit documentation. In addition to the emphasis on its own research and development, we are also actively seeking excellent cooperation units, strive for technical interaction and growth opportunities. The qfn algorithm was introduced in 5dx software version 8. Making use of our original leadframe etching and halfetching technology, we have developed lowcost interposers for csp such as son as well as qfn and bga. On the contrary, plastic leadframe packages remain widely used. Solder paste stencil design for optimal qfn yield and. The quad flat nolead qfn package is a leadless nearchipscale package csp that is growing in popularity due to its compact size, reduced weight, and. Quad flat nolead qfn application note and best practices objective the purpose of this application note and best practices guide is to describe the qfn type component and provide testing methodology and best practices to ensure robust testing and quality results. There is an increasing number of ic devices being packaged in nolead packages such as the quad flat nolead qfn or microlead frame mlf packages.

Qn84 quadflat no lead package leadless quad flat pack qfn packages are plasticencaps ulated with a copper lead frame substrate, providing a robust, lowcost solution for small form factor applications such as mobile handsets and other battery operated consumer products. The cc256x qfn reference design is based on the following requirements. Board layout and stencil information for most texas instruments ti quad flat. A singlesided assembly a low manufacturing cost for pcbs when designing a pcb for the cc256x qfn device, design rules and layout guidelines must be. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements. A new configurable sintered interconnect qfn package for high performance, high lead count and low cost applications. Pss services ic packaging experts, ic package design. This leadframe interposer is radically cheaper than conventional organic substrate and tape interposer used for csp.

Tn1257 pcb layout recommendations for qfn packages. Qfn style packages see figure 1 are physically robust, thermally efficient, and occupy much less pcb space than equivalent qfp packages. Assembly and ews design rules for wire bond interconnect dice. Elimination of esd events and optimizing waterjet deflash process for reduction of leakage current failures on qfnmr lead frame devices. Procurement and quality general spec for metallic leadframe. Anysilicon find asic design companies, ip cores and. A design and manufacturing guide for the lead frame chip scale package lfcsp.